Thermal Grizzly Minus Pad Basic 120x20x1mm 4 Pack
High-performance alternative to thermal paste
With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity.
The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or when a gap between the heat source and heatsink needs to be bridged. It is therefore optimal for use on memory chips or voltage regulators. It is based on a silicone carrier complex and aluminum oxide as the heat transfer medium, achieving thermal conductivity similar to that of thermal paste.
The Minus Pad is available in various sizes and thicknesses from 0.5 to 3 millimeters. Since it works optimally with minimal contact pressure and the thermal conductivity is hardly affected by the thickness, the choice of thickness should only be based on the distance to be bridged.