THERMAL PAD /HEATSINK SILICONE/TG-P-01 GEMBIRD
Product code:
TG-P-01
- Dimensions: 100 x 100 x 1 mm
- Thermal conductivity: 2.0 W/m-K W/m·K
- Height: 1 mm
Price
2.60 €
Heatsink silicone thermal pad 100 x 100 x 1 mm
- Silicone thermal pad designed for merging with heat sinks
- It facilitates the removal of heat from the processor, chipset and processor to the heat sink
- Excellent thermal impedance
- It provides stability, perfectly merges, does not stratify, does not oxidize.
- It does not conduct electricity
Technical details
Dimensions100 x 100 x 1 mm
Thermal conductivity2.0 W/m-K W/m·K
Height1 mm
Price
2.60 €
Product can only be orderedProduct is not currently available in stores.Ordering to a store 2-5 working days.
Ordering to a store
Available to order:
Ordering to a store 2-5 working days.76 pcs