Thermal Grizzly Putty Advance Thermal Paste - 100g
- Amount: 0.1500 kg
Thermal Grizzly introduces the Thermal Putties, a new product line specifically developed for modifying graphics cards and replacing thermal pads between PCBs and heatsinks. However, the Thermal Putties can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles.
Flexible replacement for thermal pads with a wide range of applications
Especially suitable for heatsinks with varying distances to critical components
Advance version with high thermal conductivity for more powerful components
Safe to use thanks to its electrically insulating property
The flexible alternative to thermal pads: The Thermal Grizzly Putty Advance
Thermal Grizzly Putty is a non-electrically-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences and is therefore ideal as a replacement for thermal pads on graphics cards and other devices.
Typically, several types of thermal pads with varying heights are used from the factory, so when replacing the pads or converting the cooler to a GPU water cooler, several different pads are needed. This problem is solved by the flexible applicability of Thermal Grizzly Putty.
How much Thermal Grizzly Putty do I need?
For modifying a single, smaller graphics card without a backplate (e.g., GeForce GTX 1060), about a 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card such as a GeForce RTX 4090, usually a 30-gram jar is sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side.
On the back, between the PCB and the backplate, larger graphics cards often have a consistent, larger gap between the two surfaces. Here, about two 30-gram jars or one 100-gram jar are needed if you want to completely fill this gap.
Three variants for different applications
The manufacturer offers three different variants for every performance class. The Basic variant is suitable for efficient components that generate low heat. The Advance variant, on the other hand, is aimed at the midrange segment with more powerful components thanks to its higher thermal conductivity. For the high-end segment, Thermal Grizzly offers Putty Pro, which ensures optimal cooling for your high-end components thanks to its particularly high thermal conductivity.
Flexible and safe use
Before application, the target surface should be thoroughly cleaned and degreased, for example with cleaning wipes from Thermal Grizzly or common isopropanol. Thanks to its electrically insulating property, it can be applied over large areas with the supplied spatula. Alternatively, the Thermal Putty can be formed by hand into small pellets that can be adapted in size to the surface to be applied (e.g., VRAM, SMD).